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Driving Reliable 5G Connectivity for a Smarter, More Secure Future

About Us

At CapV, we specialize in robust, 5G microchip communication solutions that adapt seamlessly to any situation. Our advanced broadband solutions automatically detect and avoid signal jamming ensuring security and efficiency. These AI enabled microchips are designed to support ultra-reliable, low-latency, high-performance tasks required in mission critical environment. With over 20 years of expertise in RF components and microchip technologies, we simplify communication challenges, providing peace of mind for mission critical operations. 

How We Stack Up

The Choice of Experts

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Our History

$15M+ in R&D Investments

$11M+ in Commercialization Investments

2004

VARACTOR
First Varactor Devices by UD & AFRL

2007

MARKET DEMAND

Market Demand Validated by Analog Bridge

2010

4" WAFER

4" Wafer Process Developed

2018

LOCKHEED MARTIN & AIR FORCE

Lockheed Martin IRaD 

AF STTR Phase 1 for UD & Indiana Micro

2021

DARPA

DARPA WARP for IM, UD, LM, 3DGS

2023-2024

CAPV FORMED

CapV formed, accepted to EC ESP, licensing agreement w/ UDRI Propel program, TVSF win, Microelectronics Commons application, working with Lockheed Martin

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31 S.  Main Street 

Suite #432

Dayton, OH, 45042

Email: Admin@CapvMicro.com

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Innovative 5G Microelectric Solutions

© 2025 CapV. All Rights Reserved.

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